AGFB023R24C2E2V System On Chip (SoC)_Taoxin Chuangke HK_integrated circuit ic_relay_electronic components _connector_transformer_discrete semiconductor_PCBA_development board_core board

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AGFB023R24C2E2V

System On Chip (SoC)

Tray

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$17,658.9540

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$17,658.9540

$52,976.8620

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AGFB023R24C2E2V

Part number：

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AGFB023R24C2E2V

System On Chip (SoC)

System On Chip (SoC)

Tray

Product parameters

TYPE	DESCRIPTION
Mfr	Intel
Series	Agilex F
Package	Tray
Product Status	ACTIVE
Package / Case	2340-BFBGA Exposed Pad
Speed	1.4GHz
RAM Size	256KB
Number of I/O	480
Operating Temperature	0°C ~ 100°C (TJ)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes	FPGA - 2.3M Logic Elements
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DMA, WDT
Supplier Device Package	2340-BGA (45x42)
Architecture	MPU, FPGA

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